Neoconix’s PCBeam ™ Technology is presented in the feature article of the March/April publication of Advancing Microelectronics magazine.

The feature article, titled “Freedom of Design – Custom, High Reliability Connectors with Low Cost Tooling,” presents a background on PCBeam Connector Technology before detailing the wide spectrum of new connector design options that are now available in the system designer’s toolkit. Experimental data is presented to quantify the impact of various design choices on the subsequent performance and reliability of the connector.

Advancing Microelectronics magazine is the premier publication for technical and business-related information on the microelectronics and electronic packaging industries. Advancing Microelectronics is available as a printed magazine or accessible electronically through the IMAPS website (www.imaps.org).

Neoconix has teamed up with Intel to develop a low-profile socket alternative for Intel’s Jasper Forest family of processors based on the Nehalem-EP architecture. Neoconix’ new socket allows Intel’s customers to maximize the performance and power advantages of this new architecture.

The new low-profile socket from Neoconix supports Intel’s LGA1366 footprint and offers a 50% reduction in mated height compared to traditional LGA1366 sockets. The lower socket profile translates into added clearance for heat dissipation – up to an additional 20% in power dissipation capability in some cases. The socket passes MIL-STD-810F tests for increased reliability in rugged environments.