Neoconix’s PCBeam™ technology is an innovative new approach to designing and manufacturing electrical connectors. In contrast to traditional molding & stitching of metal contacts, Neoconix uses photolithography and etch processes to produce its connector products. Inherent with this PCB-style approach is tremendous design versatility and a wealth of new capabilities.

Neoconix can address standard as well as very custom contact layouts and currently offers products with array pitches down to 0.8mm and row pitches down to 0.5mm. Neoconix achieves this scalability while maintaining the advantages of a mechanically and electrically robust, all-metal spring structure. PCBeam™ interposers can be used for board-to-board, LGA device-to-board, and flex-to-board applications. The technology can also be applied to multilayer substrates in multi-layer interposer (MLI) embodiments.