July 2008 – Neoconix Introduces Ultra-Thin Connector.

Neoconix’s advancements in physical & electrical scalability continue with the introduction of a new ultra-low-profile interposer that is offered with just 0.25mm of compressed thickness.

This interposer was designed for solder attachment on the bottom side and compression attachment on the top side, although the approach can also be applied to dual-compression configurations. Since Neoconix’s PCBeam™ contact elements emanate off the surface of the interposer, this z-dimension scalability is achieved with no compromise in the mechanical performance of the contacts.

Neoconix is enabling low profile interconnect solutions for space-constrained and mobile applications as well as applications requiring exceptional signal integrity.

May 2008 - Neoconix to Exhibit at 2008 Electronic Components & Technology Conference (ECTC).

Neoconix will be exhibiting at the 58th ECTC conference on May 28 and 29 near Orlando, Florida. ECTC is the world’s premier international packaging, components, and microelectronic systems technology conference, and this year’s event will take place at Disney’s Contemporary Hotel in Lake Buena Vista, FL. Neoconix will be exhibiting at Booth #209.

Please visit www.ectc.net for more information.

Jan 2008 - Neoconix and Molex Partner on High Performance Flex/Interposer Assembly.

Neoconix and Molex have partnered to deliver a flexible, copper-based high-density and speed (HD&S) electrical interconnect. The low-profile interconnect integrates Neoconix's PCBeam™-based interposer with Molex’s Copper Flex technology.

This integrated interconnect solution is designed to deliver the industry’s best overall performance with unprecedented design flexibility, critical features in several of the companies’ target markets which include the telecommunications, server, mass storage, medical imaging, automatic test equipment (ATE), and military command and control center markets.

The PCBeam interposer with Copper Flex assembly is available at densities of 1.00 mm (.039") or less in a variety of pin-matrix configurations with board-to-flex pin counts of 500 input/outputs or greater; single-piece compression and tool-less hardware interfaces, and an impedance matched system that offers 100 Ohm differential and 50 Ohm single-ended options.

The Copper Flex assemblies are available in flexible cable lengths of 4 to 28 inches, and are offered in a variety of thicknesses and custom arrays of various sizes and footprints.