Interposers traditionally join two mating boards that have mirror-image pin assignments.  However, with Neoconix’s PCBeam™ technology, a straight-through signal path is no longer a constraint.   The FR4 core can simply be designed as if it were a multi-layer PCB.  With proper preparations, quick-turn MLI changes can be implemented in as little as 2 weeks.

This capability can be utilized for situations such as:

•   Re-routing pin assignments following new silicon debug
•   Enabling usage of new devices on legacy boards that are not footprint compatible
•   Incorporation of internal ground or thermal planes within interposer
•   Incorporation of embedded capacitors, etc.