The Neoconix Low-Profile 1366 LGA Socket offers z-axis space savings for microprocessor socketing in space constrained and high-reliability applications. The reduced profile provides extra allowance for heatsink design and increased airflow.
The product incorporates Neoconix’s photolithography-based PCBeamTM Technology and offers outstanding true position in an FR-4 based connector substrate that is CTE-matched with the microprocessor and mainboard. The socket passes MIL-810F for shock and vibration.
This socket is compatible with Intel packages built for the Socket B form factor. Neoconix also offers low-profile solutions for Intel’s Socket J (771-position), AMD’s Socket F (1207-position), AMD’s Socket C32, (1207-position), and AMD’s Socket G34 (1944-position).
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