Jim Witham joined Neoconix as President & CEO in February 2009. Jim brings to Neoconix more than 20 years experience in operations management, international sales & marketing, and business development.

Most recently, Jim was President & CEO of Fultec Semiconductor, a leading supplier of high-bandwidth circuit protection components. Prior to Fultec, Jim worked for both Aegis Semiconductor and Genoa Corporation, where he held the positions of Vice President of Sales and Marketing and played a key role in setting corporate strategy with responsibility for sales, marketing, product management, and application engineering for the companies.

Prior to Genoa, Jim was the Vice President and General Manager of the Raychem Interconnect Division within Tyco Electronics, a division focused on electrical cables and wire harnesses with annual revenues of $500 million. While at Raychem, Jim spent 5 years in Japan and built the Asian sales and marketing team of their circuit protection division.

Jim received an M.B.A from the Harvard Graduate School of Business, and an M.S. and B.S. with distinction in Mechanical Engineering from Stanford University.

Dinesh Kalakkad joined Neoconix as Vice President of Engineering in November 2007. Dr. Kalakkad previously served as Senior Director of Product Engineering in Formfactor. Prior to Formfactor, Dr. Kalakkad spent 8 years in Novellus systems where he held numerous technical and management positions in the Electrofill and Surface Integrity Business Groups. Prior to Novellus Systems, he spent 2 years in Atmel Corporation in process engineering roles.

Dr. Kalakkad received his Masters and Doctorate in Chemical Engineering from the University of New Mexico and received a Bachelors degree in Chemical Engineering from Indian Institute of Technology, Bombay.

David Light joined Neoconix in September, 2009 as Vice President, Technology. Prior to joining Neoconix, he was an independent consultant providing ongoing and project-based services in technology development, intellectual property evaluation, business development and strategy, and technology marketing to clients including Tessera, Samtec, Flint Hills Solutions, Microconnex, Coleman Research Group, Latham and Watkins, and Neoconix, in areas spanning microelectronics packaging, high density substrates, interconnect, and surface mount technology. His career has included fundamental process and materials research, process and product development, technology management, marketing and business development, manufacturing operations, and General Management. His areas of expertise include substrates and printed circuits, semiconductor packaging, assembly and test, interconnect technologies, test tooling, and miniaturized electronic systems.
David’s career began at the IBM T.J. Watson Research Center, in the electrochemical studies group, and has included technology and business leadership positions at IBM Microelectronics, Tessera, Flex2Chip, and Sunright / KES Systems.
David is a graduate of Stanford University. He has over three dozen issued US patents and has authored numerous technical publications and presentations. He is a member of IEEE CPMT, IMAPS, and the Electrochemical Society.

Stephen Coates joined Neoconix as Vice President of Operations in September of 2009. Stephen brings more than 20 years experience in engineering, operations & supply chain management in technology companies. Most recently, Stephen was VP Product Engineering & Operations for Fultec Semiconductor, and prior to Fultec he was VP Operations at Symmorphix and DigiLens. In all roles, Stephen has implemented and managed successful production ramps in startup environments.
Stephen holds a Bachelor’s Degree in Electrical & Electronic Engineering and a post graduate in Manufacturing from Nottingham University, England. Stephen has several patents filed in both semiconductor fabrication & advanced packaging.