Jim Witham, President & CEO
Jim Witham joined Neoconix as President & CEO in February 2009. Jim brings to Neoconix more than 30 years experience in operations management, international sales & marketing, and business development.
Most recently, Jim was President & CEO of Fultec Semiconductor, a leading supplier of high-bandwidth circuit protection components. Prior to Fultec, Jim worked for both Aegis Semiconductor and Genoa Corporation, where he held the positions of Vice President of Sales and Marketing and played a key role in setting corporate strategy with responsibility for sales, marketing, product management, and application engineering for the companies.
Prior to Genoa, Jim was the Vice President and General Manager of the Raychem Interconnect Division within Tyco Electronics, a division focused on electrical cables and wire harnesses with annual revenues of $500 million. While at Raychem, Jim spent 5 years in Japan and built the Asian sales and marketing team of their Circuit Protection Division.
Jim received an M.B.A. from the Harvard Business School, and an M.S. and B.S. with distinction in Mechanical Engineering from Stanford University.
Dave Light, Chief Technology Officer
Dave Light joined Neoconix as Vice President of Technology in September, 2009, and was named Chief Technology Officer in March, 2011. In this role, he is responsible for development and execution of the company's technology roadmap; process, product and applications engineering; prototype and manufacturing operations in Sunnyvale, CA; high volume offshore manufacturing; and global supply chain management.
Prior to joining Neoconix, Dave ran an independent consulting firm supporting clients involved in electronics miniaturization including IC packaging, assembly, and test; high density substrates; compact interconnect solutions; high density SMT assembly; and systems integration. Dave began his career as an electrochemist at the IBM T.J. Watson Research Center in the Manufacturing Research Group, supporting IBM development and manufacturing divisions involved in semiconductor fabrication, information storage technologies, advanced printer technologies, and advanced substrate and packaging technologies. He has subsequently held senior technology and business leadership positions at IBM Microelectronics, Tessera Technologies, Flex2Chip, Sunright Limited and KES Systems.
Dave is a graduate of Stanford University. He has over three dozen issued US patents and has authored numerous technical publications and presentations. He is a member of the IEEE Components, Packaging and Manufacturing Technology Society, IMAPS, and the Electrochemical Society.
Dinesh Kalakkad, Vice President of Sales & Marketing
Dinesh Kalakkad joined Neoconix in November 2007 as Vice President of Engineering and holds the position of Vice President of Sales & Marketing. Dr. Kalakkad previously served as Senior Director of Product Engineering in Formfactor. Prior to Formfactor, Dr. Kalakkad spent 8 years in Novellus systems where he held numerous technical and management positions in the Electrofill and Surface Integrity Business Groups. Prior to Novellus Systems, he spent 2 years in Atmel Corporation in process engineering roles.
Dr. Kalakkad received his Masters and Doctorate in Chemical Engineering from the University of New Mexico and received a Bachelors degree in Chemical Engineering from Indian Institute of Technology, Bombay.
Phil Damberg, Vice President of Operations
Phil Damberg joined Neoconix in May of 2012 as Vice President of Operations. He is responsible for worldwide manufacturing, supply chain and logistics. Prior to Neoconix, Phil served as Vice President of Product Engineering at Invensas where he was responsible for new product development and prototyping for advanced semiconductor packaging technologies.
Prior to Invensas, Phil spent 11 years at Tessera where he held management positions in manufacturing and product development engineering for chip scale packaging and advanced interconnect. Phil has more than 25 years of industry experience in semiconductor process and packaging engineering and operations management with companies including LSI Logic Corporation and Signetics Corporation (now Philips).
Phil received his Bachelorís degree in Engineering Management from the U.S. Air Force Academy in Colorado. He is the author of a number of patents relating to semiconductor devices.
Woody Maynard, Senior Director of Product Engineering
Woody Maynard joined Neoconix in 2004 and is Senior Director of Product Engineering. Since joining Neoconix, he has held various roles in product engineering, marketing, and sales.
Prior to joining Neoconix, Woody was Business Development Manager and Director of Marketing for High Connection Density (HCD), a manufacturer of advanced connectors and memory subsystems. Prior to HCD, Woody worked as an engineer in Motorola's Semiconductor Products Sector (now Freescale), working with wireless, transportation, and memory devices. His positions at Motorola included research & development, device engineering, product engineering, and product analysis.
Woody received his M.B.A. from Kellogg School of Management and a Masters of Engineering Management from McCormick School of Engineering, both at Northwestern University. Woody also holds a Bachelor of Science degree in Materials Science Engineering from Cornell University.