Asuri Raghavan joined Neoconix as President & CEO in June, 2006. Prior to joining Neoconix, Mr. Raghavan was Executive Vice President of the Semiconductor Group at Unaxis, a Swiss-based technology company. Mr. Raghavan was previously Executive Vice President of the Surface Integrity Group at Novellus following the Novellus acquisition of Gasonics International in 2001.

Prior to the acquisition by Novellus, Mr. Raghavan was the President and CEO of Gasonics, a publicly traded semiconductor equipment company. Prior to running Gasonics, Mr. Raghavan held various management positions in his 15 year tenure at Kulicke & Soffa Industries culminating as President of Kulicke & Soffa’s Equipment Group.

Mr. Raghavan holds a Bachelor of Engineering (Hons.) from the University of Madras (Chennai), India, and a Master of Arts degree in Computer and Information Science from Temple University.

John Williams brings to the company over 17 years of engineering and manufacturing experience in advanced packaging and semiconductor process development. Prior to founding Neoconix he was Vice President of Engineering and served as a member of the corporate executive staff at High Connection Density (HCD), a connector and subsystems company in Silicon Valley.

He also has extensive semiconductor R&D and manufacturing experience from Advanced Micro Devices (AMD) and Motorola. Mr. Williams hold numerous patents in electronic packaging, printed circuits, and semiconductor processing.

Dirk Brown co-founded Neoconix and was acting CEO of the company until mid-2006. He was previously Executive Vice President at High Connection Density (HCD) where he was General Manager for both the connector and subsystems business units.

Earlier in his career, Dr. Brown managed semiconductor R&D programs at Advanced Micro Devices (AMD). He has served as an industry mentor with the Semiconductor Research Corporation (SRC) and as a member of the Joint Electron Device Engineering Council (JEDEC).

Dr. Brown has published extensively and has filed over 20 patents in the areas of connectors, semiconductors, and printed circuit technologies. He earned his Ph.D. in Materials Science and Engineering from Cornell University and has an M.B.A. from San Jose State University.

Larry Dittmann is the former Chairman, President, & C.O.O of Y-connect Incorporated, a start-up he founded and led to become a multimillion dollar interconnections business. Prior to that, he worked at AMP Incorporated where he most recently served as Divisional Vice President for Operations of Asia Pacific residing in Shanghai, China, and Divisional Vice President for Operations, Americas, with over 20,000 employees.

During his distinguished 27-year career at AMP he held various divisional management, business development and engineering positions. He has a broad and deep background in total company management, including product development, industry marketing/sales, technology integration, and large and small scale global manufacturing.

Mr. Dittmann earned a B. S. from Pennsylvania State University in electrical engineering, and is past General Manager’s Council member of MAPI where he was a sought after lecturer and advisor on concurrent engineering. He holds 25 patents and has 20 pending in the electrical and electronic interconnections field.

Reg Simpson joined Neoconix as Vice President of Operations in May 2005. He brings to Neoconix over 20 years of experience in manufacturing and quality assurance.

Before joining Neoconix, Mr. Simpson was Senior Vice President, Chief Operating Officer at QuickLogic. Prior to that, he was Operations Manager and Quality Director at LSI Logic. Mr. Simpson has held management positions in engineering, manufacturing, quality and reliability at GE Intersill and Fairchild Semiconductor.

He holds a Mechanical Engineering Certificate from the Coatbridge Polytechnic Institute in Scotland, a degree in Technical Horology (mechanical engineering) from the Barmulloch Polytechnic Institute and Scotland and studied for a degree in electronic engineering at the Kingsway Polytechnic Institute in Scotland.

Dinesh Kalakkad joined Neoconix as Vice President of Engineering in November 2007. Dr. Kalakkad previously served as Senior Director of Product Engineering in Formfactor. Prior to Formfactor, Dr. Kalakkad spent 8 years in Novellus systems where he held numerous technical and management positions in the Electrofill and Surface Integrity Business Groups. Prior to Novellus Systems, he spent 2 years in Atmel Corporation in process engineering roles.

Dr. Kalakkad received his Masters and Doctorate in Chemical Engineering from the University of New Mexico and received a Bachelors degree in Chemical Engineering from Indian Institute of Technology, Bombay.