Device-to-board interposers are used for applications such as mating ASIC’s or multi-chip-modules (MCM’s) to a motherboard. Neoconix designs interposers to mate against either organic or ceramic substrates. Pincounts can range from tens of contacts to greater than 5,000 positions. These interposers are characterized by high current capacity (> 1A typical), low resistance (< 15mOhm typical), and a CTE that is matched with the underlying printed circuit board.